Surface Mount Technology (SMT) Assembly – Fast, Accurate, and Reliable
Our advanced SMT assembly services deliver the speed and precision your electronic products require. With automated lines, expert operators, and rigorous inspection processes, Secure Semiconductor Manufacturing can handle everything from low-volume prototypes to high-volume production runs.
Why choose our SMT assembly services?
- Automated pick-and-place systems for fine-pitch components
- Leaded and lead-free (RoHS) soldering options
- Reflow soldering with thermal profiling
- Double-sided assembly with mixed technology compatibility
- 01005 component capability
- X-ray and AOI inspection
- IPC-A-610 certified workmanship
Our process ensures high-reliability SMT assemblies that are ready for demanding environments, including aerospace, defense, and medical applications.
SMT Assembly – Services Included
Automated Pick-and-Place Technology
Our high-speed machines accurately place micro-sized components (down to 01005) with extreme precision, supporting both fine-pitch ICs and dense layouts with consistent quality across runs.
Lead-Free & Leaded Reflow Soldering
We offer both traditional tin/lead and RoHS-compliant lead-free soldering profiles, including thermal profiling for optimal reflow settings tailored to your PCB and components.
Double-Sided SMT Assembly
We assemble PCBs with components on both sides using a combination of reflow and selective soldering processes, allowing for compact, space-saving designs without compromising performance.
Mixed Technology Integration (SMT + Through-Hole)
Need a hybrid approach? We can assemble boards that combine surface-mount devices with traditional through-hole components, ideal for connectors, power stages, or legacy parts.
Fine-Pitch and BGA Assembly
We specialize in placing and soldering fine-pitch devices and Ball Grid Arrays (BGAs), including underfill and X-ray inspection to verify joint integrity and alignment.
Automated Optical Inspection (AOI)
Post-assembly AOI checks for misalignment, insufficient solder, tombstoning, polarity, and more to ensure 100% compliance with IPC-A-610 standards.
X-Ray Inspection & Functional Testing
For hidden solder joints such as BGAs and LGAs, we provide real-time X-ray inspection. Functional testing services are available to validate power, signal, and component operation before shipment.
